Laser stealth cutting is to focus the laser with a specific wavelength inside the material through an optical system. The optical system has excellent focusing performance, can compress the light to the diffraction limit, has a high peak power density, forms a modified layer in the middle of the material, and divides the workpiece by expanding the adhesive film and other methods without damaging the surface and edge of the workpiece. Laser stealth cutting is a scheme for laser cutting wafers, very good to avoid the problems of grinding wheel scribing.
In terms of appearance, through the extraction of visual brand image elements and undulating mountain lines, safety and sense of strength are taken as the keynote of appearance design. At the same time, red, blue and black colors are used to show the scientific and technological sense and unique industry emotion of the product. Rounding of the edges makes the product more vivid and advanced while keeping the main tone unchanged.